Hot sale High Speed Sip Packing Machine - IC Packaging Converting Machine – JKTech

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Our enterprise since its inception, usually regards product top quality as business life, repeatedly enhance manufacturing technology, make improvements to product excellent and continuously strengthen enterprise total high quality administration, in strict accordance with all the national standard ISO 9001:2000 for Lead Free Solder Dross Recovery Machine, Solder Ball Soldering, Laser Soldering Machine, We encourage you to make contact as we are looking for partners in our venture. We are sure you will find doing business with us not only fruitful but also profitable. We are ready to serve you with what you require.
Hot sale High Speed Sip Packing Machine - IC Packaging Converting Machine – JKTech Detail:

IC Tray

Tray

tape2

Tape / Reel

Tape

Tube packaging

■  Automatic components loading, furling and sealing; Aoi marking & orientation inspection is optional.

■ Industrial PC controlled, easy to operate and programming.

■ Converting IC packaging from Tray to Tape or Tape to Tray, Tube to tray or Tape as needs.

■ Support 6~46mm tape width.

■ IC angle can be changed freely, pick and place with a high-speed Camshaft.

■ Optional function: Mark printing or CCD visual inspection.

■ Standard Auto-tray magazine design with compact size, and a short changeover time.

■ CE – Option.

■ Free sample testing program available.

sealling

Tape Sealing

NG marking

NG Marking

Position correction

Position Correction

High quality material Wide scalability
 ic pelmallt (1)  ic pelmallt (4)
Wide expandability compatible with packaging of multiple specifications

Super application compatibility 

 ic pelmallt (2)

 

 

E1=8~32mm, E2=3~26mm, t=0.3~0.5mm, e=4mm*Optional double needle wheel configuration can be compatible with double row pinhole carrying tape packaging

 ic pelmallt (3)

Compatible with varies of programmers

Built-in auto-tray design, compact in size, all special aluminum and is easy to maintain.

Maximum 25 trays storage capacity.

Automatic tray replenishes.

Compatible with JEDEC Tray standard: 12.70x 5.35” inches

so1
JEDEC TRAY

Specification:

If you are interested in our products, please email to Sales@jinke-tech.com

Packaging speed: 6000UPH
Packaging accuracy: ±0.05 mm
Max. IC size Lx W: 32 x 32mm
Max. Tape width: 46mm
Loading: Tube, Tape, Tray
Output: Tape, Tray
CCD AOI inspection: option
Auto-tray magazine: standard and compatible with JEDEC spec
Language: Chinese & English
Power supply: 220v 1 phase, 50 Hz, <1KW
Compress air: 0.4~0.6mpa, 45L/min
Footprint: L040 x W750x H1530 mm

Product detail pictures:

Hot sale High Speed Sip Packing Machine - IC Packaging Converting Machine – JKTech detail pictures


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  • The customer service staff is very patient and has a positive and progressive attitude to our interest, so that we can have a comprehensive understanding of the product and finally we reached an agreement, thanks!
    5 Stars By Ivy from Sevilla - 2017.02.28 14:19
    The company account manager has a wealth of industry knowledge and experience, he could provide appropriate program according our needs and speak English fluently.
    5 Stars By Deborah from Turkey - 2017.01.28 18:53
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